UV and infrared laser ablation

What it does

Two Keyence laser systems remove material by ablation: short, intense pulses focused on the surface vaporise a thin layer at each pass, and a scanner draws the pattern line by line. Both scan in three axes at once, so the focus follows the height of the part and the beam works on tilted, stepped and curved surfaces as well as on flat ones.

The ultraviolet laser, at 355 nm, is absorbed within a very thin layer of almost every material: it draws fine features and heats the material around them very little, on silicon, glass, polymers and coatings alike. The infrared laser, at 1064 nm and 13 W, delivers more power over a wider field and removes material faster, for deeper grooves and larger shapes.

A blade cuts only straight lines across the whole part; the laser draws any outline, opens holes and windows, thins chosen areas and writes marks and codes. As after dicing, the thin layer affected by the laser can be removed by chemical etching.

What we use it for

• Shapes a blade cannot cut

  Curved outlines, holes and windows in silicon and germanium crystals and in the parts that hold them.

• Patterns on the surface

  Grooves and engraved patterns of controlled depth on crystals and holders.

• Marking

  Codes and reference marks on crystals, holders and fixtures, so each piece can be traced through processing and measurement.

Working with us

Send us a drawing and the material: we can try the pattern on a test piece and tell you which of the two lasers suits it.