Dicing saw for 200 mm wafers

What it does

The larger of our two dicing saws, for wafers up to 200 mm and square plates up to 250 × 250 mm. It cuts like the DAD3220, with a water-cooled diamond blade, through the whole thickness or to a set depth, on a table that travels 260 mm in both directions.

Its high bridge frame carries the spindle with little vibration and thermal drift, which keeps the cuts precise through long sessions. Servo motors drive every axis: the blade height is set in steps of 0.2 nm and repeats within 1 µm, and the table indexes with an accuracy of 2 µm over 260 mm.

The spindle runs up to 60,000 rpm, and with larger blades the maker specifies cuts in parts 10 mm thick or more.

What we use it for

• Whole 200 mm wafers

  Silicon and germanium wafers diced in one set-up, without first cutting them down to fit the smaller saw.

• Large and thick plates

  Plates for X-ray and γ-ray optics, and thick crystals that need a long or deep cut.

• Two saws, two set-ups

  One saw can stay set up for a long series while the other runs tests with a different blade.

Working with us

For wafers and plates too large for the 150 mm saw: tell us the material, the size and the cut, and we will plan test cuts together.