Equipment › Measure
Infrared wafer metrology
FOGALE nanotech T-Map Dual IR 300M
Thickness maps of wafers by infrared interferometry.
Work with us on this instrument
What it does
Silicon is opaque to visible light but transparent in the near infrared. The T-Map sends infrared light into the wafer and records the reflections from its front and back faces; the interference between them gives the thickness at that point, and a scan across the wafer turns it into a map.
From the map we read the thickness, its total variation and wedge, and local thin or thick spots, before and after grinding, polishing or etching. Heavily doped silicon absorbs the infrared and needs other methods.
What we use it for
BULLKID wafers
Thickness of the silicon wafers for BULLKID detector arrays, before they are diced.
Thinned and polished crystals
Uniformity of crystals after thinning and polishing, where thickness sets how a plate bends or how well it diffracts.
Working with us
We can map the thickness of your wafers and thinned crystals in joint projects.